Tokyo, Japan

Hiroki Shiota

This inventor holds 16 USPTO granted patents and 2 published patent applications and 1 EPO patent, primarily in Semiconductor Devices. Top assignees: Mitsubishi Electric Corporation, Mitsubishi Denki Kabushiki Kaisha. Active years: 2000-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hiroki Shiota. Retrieved from https://idiyas.com/inventor/hiroki-shiota

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 16 

% Patents Active = 81.3

 

Average Co-Inventor Count = 4.1

ph-index = 2

Forward Citations = 48(Granted Patents)


Location History:

  • Chiyoda-ku, JP (2016 - 2020)
  • Tokyo, JP (2000 - 2024)

Company Filing History:


Years Active: 2000-2026

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Areas of Expertise:
Porous Material
Heat Sink
Insulating Substrate
Electric Power Converter
Radiation Plate
Signal Transmission
Rotary Electric Machine
Insulation Inspection
Heat Radiation Structure
Stator Coil
Heat Conductive Sheet
Powder Module
16 patents (USPTO):Explore Patents

Title: Hiroki Shiota: Innovator in Semiconductor Technology

Introduction

Hiroki Shiota is a prominent inventor based in Tokyo, Japan, known for his significant contributions to semiconductor technology. With a total of 16 patents to his name, he has made remarkable advancements in the field, particularly in the design and functionality of semiconductor devices.

Latest Patents

One of his latest patents is a frame member with a porous material between a semiconductor module and a heat sink. This innovative semiconductor device includes a semiconductor module, an insulating resin layer, a frame member, and a heat sink. The insulating resin layer is bonded to the semiconductor module and contains a first resin. The frame member surrounds the insulating resin layer and includes a porous material. The heat sink and semiconductor module sandwich the insulating resin layer and frame member, compressing the frame member while it is sandwiched between them. The first resin enters the pores of the porous material, enhancing the device's performance.

Another notable patent is a semiconductor device that features an inner frame surrounding the outer circumference of a semiconductor chip and an outer frame that encompasses the inner frame. The outer frame is designed with an exterior wall and a fibrous reinforcing member wound around it. This design prevents broken pieces of the semiconductor device's components from scattering, thereby improving the reliability of the entire system and facilitating downsizing of the semiconductor device.

Career Highlights

Hiroki Shiota has worked with leading companies in the industry, including Mitsubishi Electric Corporation and Mitsubishi Denki Kabushiki Kaisha. His experience in these organizations has allowed him to develop and refine his innovative ideas, contributing to the advancement of semiconductor technology.

Collaborations

Throughout his career, Hiroki has collaborated with notable colleagues, including Hideki Takigawa and Takashi Nishimura. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies in the semiconductor field.

Conclusion

Hiroki Shiota's contributions to semiconductor technology through his innovative patents and collaborations have significantly impacted the industry. His work continues to inspire advancements in the design and functionality of semiconductor devices, showcasing the importance of innovation in technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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