The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 23, 2018

Filed:

Nov. 08, 2013
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Manabu Yoshinori, Tokyo, JP;

Atsushi Sakaue, Tokyo, JP;

Tatsuro Hino, Tokyo, JP;

Hironori Tsuiki, Tokyo, JP;

Shinichi Okada, Tokyo, JP;

Hiroki Shiota, Tokyo, JP;

Masaya Inoue, Tokyo, JP;

Shogo Okamoto, Tokyo, JP;

Shinji Nishimura, Tokyo, JP;

Akira Hashimoto, Tokyo, JP;

Shinkichi Sawa, Tokyo, JP;

Yutaka Ikura, Tokyo, JP;

Ryuichi Kitora, Tokyo, JP;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02K 3/34 (2006.01); H02K 1/16 (2006.01); H02K 3/28 (2006.01); H02K 15/12 (2006.01);
U.S. Cl.
CPC ...
H02K 3/34 (2013.01); H02K 1/16 (2013.01); H02K 1/165 (2013.01); H02K 3/28 (2013.01); H02K 3/345 (2013.01); H02K 15/12 (2013.01);
Abstract

A side surface at the outside of a plurality of teeth portions of one separated core is faced to a side surface of teeth portions of an adjacent separated core, so as to form a second slot which is straddled between the adjacent separated cores, and a first slot is formed by a plurality of teeth portions of one separated core, and a width size of the first slot is identical to a width size of the second slot, and coil conductor storage space is formed in the first slot via a first insulating component, and coil conductor storage space is formed in the second slot via a second insulating component, and a thickness size of the first insulating component is different from a thickness size of the second insulating component.


Find Patent Forward Citations

Loading…