The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2026
Filed:
Apr. 02, 2021
Mitsubishi Electric Corporation, Tokyo, JP;
Hirotaku Ishikawa, Tokyo, JP;
Koki Kishimoto, Tokyo, JP;
Kazutake Kadowaki, Tokyo, JP;
Kunihiko Tajiri, Tokyo, JP;
Yoshitaka Miyaji, Tokyo, JP;
Hiroki Shiota, Tokyo, JP;
Yasutomo Otake, Tokyo, JP;
MITSUBISHI ELECTRIC CORPORATION, Tokyo, JP;
Abstract
A power semiconductor according to the present disclosed technology is a case-type power semiconductor device, in which a case is formed by mixing a heavy element material and a conductive material with a material having high processability, the conductive material is not a light metal, and the electric resistance of the case is 1.0 E5 to 1.0 E11 [Ω]. In addition, the power semiconductor according to the present disclosed technology is a transfer mold-type power semiconductor device, and includes a transfer mold-type sealing resin including a sealing resin containing a heavy element material and a sealing resin containing a conductive material, in which the conductive material of the sealing resin containing a conductive material is not a light metal.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile