Hirotaku Ishikawa

Title: Hirotaku Ishikawa: Power Semiconductor Invention

Introduction

Hirotaku Ishikawa is an inventor associated with Mitsubishi Electric Corporation in Tokyo, Japan. His listed patent concerns the design of power semiconductor devices and their cases or sealing materials.

Latest Patents

The provided information lists one patent for Ishikawa: “Power semiconductor device.” The invention describes a case-type power semiconductor device whose case combines a material with high processability with a heavy-element material and a conductive material. The conductive material is not a light metal, and the case has an electrical resistance of 1.0 × 10⁵ to 1.0 × 10¹¹ ohms.

The patent also describes a transfer-mold-type power semiconductor device with sealing resin that includes both heavy-element-containing resin and conductive-material-containing resin. The conductive material in the latter resin is not a light metal. Ishikawa’s listed portfolio comprises 1 patent.

Career Highlights

The available details associate Ishikawa’s work with Mitsubishi Electric Corporation. His listed invention focuses on material composition and electrical resistance in power semiconductor packaging.

Collaborations

Koki Kishimoto and Kazutake Kadowaki are identified as Ishikawa’s coworkers. The provided information does not specify their roles in the patent or the extent of their collaboration.

Conclusion

Hirotaku Ishikawa’s listed patent addresses power semiconductor device packaging through specific combinations of heavy-element and conductive materials, reflecting his documented work associated with Mitsubishi Electric Corporation.