The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 05, 2012
Filed:
Sep. 12, 2008
Kenji Mimura, Tokyo, JP;
Hideki Takigawa, Tokyo, JP;
Hiroki Shiota, Tokyo, JP;
Kazuhiro Tada, Tokyo, JP;
Takashi Nishimura, Tokyo, JP;
Hiromi Ito, Tokyo, JP;
Seiki Hiramatsu, Tokyo, JP;
Atsuko Fujino, Tokyo, JP;
Kei Yamamoto, Tokyo, JP;
Motoki Masaki, Tokyo, JP;
Kenji Mimura, Tokyo, JP;
Hideki Takigawa, Tokyo, JP;
Hiroki Shiota, Tokyo, JP;
Kazuhiro Tada, Tokyo, JP;
Takashi Nishimura, Tokyo, JP;
Hiromi Ito, Tokyo, JP;
Seiki Hiramatsu, Tokyo, JP;
Atsuko Fujino, Tokyo, JP;
Kei Yamamoto, Tokyo, JP;
Motoki Masaki, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
Provided is a heat conductive sheet obtained by dispersing an inorganic filler in a thermosetting resin, in which the inorganic filler contains secondary aggregation particles formed by isotropically aggregating scaly boron nitride primary particles having an average length of 15 μm or less, and the inorganic filler contains more than 20 vol % of the secondary aggregation particles each having a particle diameter of 50 μm or more. The heat conductive sheet is advantageous in terms of productivity and cost and excellent in heat conductivity and electrical insulating properties.