This inventor holds 3 USPTO granted patents. Top assignees: Mitsubishi Electric Corporation, Mitsubishi Denki Kabushiki Kaisha. Active years: 2000-2012.
Company Filing History:
2 out of 16,571 
1 out of 21,351 
Years Active: 2000-2012
Title: Innovations of Hideki Takigawa
Introduction
Hideki Takigawa is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of semiconductor technology. With a total of 3 patents to his name, Takigawa's work focuses on enhancing the performance and reliability of semiconductor devices.
Latest Patents
One of his latest patents is a semiconductor device and process for producing the same. This invention includes a base plate, a thermally conductive resin layer, an integrated layer with an electrode, and a semiconductor element. The design excels in insulating properties and reliability, making it a valuable advancement in semiconductor technology. Another notable patent is for a heat conductive sheet and method for producing the same. This heat conductive sheet is created by dispersing an inorganic filler in a thermosetting resin, which enhances productivity and cost-effectiveness while maintaining excellent heat conductivity and electrical insulating properties.
Career Highlights
Throughout his career, Hideki Takigawa has worked with leading companies such as Mitsubishi Electric Corporation and Mitsubishi Denki Kabushiki Kaisha. His experience in these organizations has allowed him to develop innovative solutions in the semiconductor industry.
Collaborations
Takigawa has collaborated with notable coworkers, including Hiroki Shiota and Kenji Mimura. Their combined expertise has contributed to the advancement of semiconductor technologies.
Conclusion
Hideki Takigawa's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor. His work continues to impact the industry positively.