Mitsubishi Electric Corporation

Mitsubishi Denki Kabushiki Kaisha

Hideki Takigawa

Hiroki Shiota

Takashi Nishimura

Kei Yamamoto

Seiki Hiramatsu

Kenji Mimura

Atsuko Fujino

Hiroshi Yoshida

Hiromi Ito

Kazuhiro Tada

Nobutake Taniguchi

Motoki Masaki

Makoto Tsukiji

Shiro Takada

Nobuo Urakawa

Wataru Bitou

Provided is a semiconductor device including: a base plate; a thermally conductive resin layer formed on an upper surface of the base plate; an integrated layer which is formed on an upper surface of the thermally conductive resin layer, and includes an electrode and an insulating resin layer covering all side surfaces of the electrode; and a semiconductor element formed on an upper surface of the electrode, in which the integrated layer is thermocompression bonded to the base plate through the thermally conductive resin layer. This semiconductor device excels in insulating properties and reliability.

Semiconductor device and process for producing same

Provided is a heat conductive sheet obtained by dispersing an inorganic filler in a thermosetting resin, in which the inorganic filler contains secondary aggregation particles formed by isotropically aggregating scaly boron nitride primary particles having an average length of 15 &#x3bc;m or less, and the inorganic filler contains more than 20 vol % of the secondary aggregation particles each having a particle diameter of 50 &#x3bc;m or more. The heat conductive sheet is advantageous in terms of productivity and cost and excellent in heat conductivity and electrical insulating properties.

Heat conductive sheet and method for producing same, and powder module

Stator coil for rotary electric machine

Growing community of inventors

Tokyo, Japan

Hideki Takigawa