Nagaokakyo, Japan

Hirofumi Shinagawa


Average Co-Inventor Count = 3.4

ph-index = 1

Forward Citations = 3(Granted Patents)


Location History:

  • Kyoto, JP (2017 - 2018)
  • Nagaokakyo, JP (2017 - 2020)

Company Filing History:


Years Active: 2017-2020

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12 patents (USPTO):Explore Patents

Title: Hirofumi Shinagawa: Innovating Component-Mounting Resin Substrates

Introduction

Hirofumi Shinagawa is a prominent inventor based in Nagaokakyo, Japan, with an impressive portfolio of 12 patents. His work focuses on advancing technologies related to resin substrates used in electronic components, showcasing his innovative contributions to the field.

Latest Patents

Among his latest innovations are several patents that revolve around resin substrates. One of his key patents describes a component-mounting resin substrate, which includes a thermoplastic resin body with a cavity designed for ultrasonic bonding. This method involves mounting a component on the resin substrate and enhancing the mounting area with a plating layer made from a material harder than the resin body. Another notable patent introduced by Shinagawa involves a component-embedded substrate that employs a multilayer body with insulating layers. This substrate features embedded components and planar conductors that overlap with the embedded components, showcasing a significant advancement in component integration.

Career Highlights

Hirofumi Shinagawa is an esteemed member of Murata Manufacturing Co., Ltd., where he utilizes his extensive knowledge and experience to drive innovation in electronic component technologies. His work has not only led to the development of key patents but has also established him as a leading figure in the innovative landscape of the electronics industry.

Collaborations

Throughout his career, Shinagawa has collaborated with notable colleagues, including Shigeru Tago and Yuki Wakabayashi. Their joint efforts reflect a commitment to pushing the boundaries of technology and enhancing the functionality of electronic devices through innovative substrate designs.

Conclusion

Hirofumi Shinagawa's contributions to the field of resin substrates reflect his dedication to innovation and excellence. With a solid foundation of patents and collaborations, he continues to play a vital role in shaping the future of electronics. His work not only enhances current technologies but also paves the way for future advancements in the industry.

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