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For the Inventor, By the Inventor

Nagaokakyo, Japan

Hirofumi Shinagawa

This inventor holds 12 USPTO granted patents. Top assignee: Murata Manufacturing Co., Ltd.. Active years: 2017-2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hirofumi Shinagawa. Retrieved from https://idiyas.com/inventor/hirofumi-shinagawa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 12

% Patents Active = 91.7

Average Co-Inventor Count = 3.4

ph-index = 1

Forward Citations = 3(Granted Patents)


Location History:

  • Kyoto, JP (2017 - 2018)
  • Nagaokakyo, JP (2017 - 2020)

Company Filing History:

goldMedal12 out of 13,796 
 
Murata Manufacturing Co., Ltd.
 patents

Years Active: 2017-2020

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12 patents (USPTO):Explore Patents
1. 10741462 - Resin substrate, component-mounting resin substrate, and method of manufacturing component-mounting resin substrate (2020-08-11),
2. 10338031 - Component-embedded substrate and substrate flaw detecting method (2019-07-02),
3. 10231342 - Component built-in substrate (2019-03-12),
4. 10219367 - Multilayer resin substrate, and method of manufacturing multilayer resin substrate (2019-02-26),
5. 9986139 - Camera module including multilayer base body, image sensor IC, lens unit, peripheral circuit components, and connector element and electronic device including same (2018-05-29),
6. 9974185 - Component-embedded substrate (2018-05-15),
7. 9961780 - Method for manufacturing resin multilayer board (2018-05-01),
8. 9922918 - Substrate for stacked module, stacked module, and method for manufacturing stacked module (2018-03-20),
9. 9854677 - Module component (2017-12-26),
10. 9848489 - Multilayer resin substrate, and method of manufacturing multilayer resin substrate (2017-12-19),
11. 9813595 - Camera module including multilayer base body, image sensor IC, lens unit, peripheral circuit components, and connector element and electronic device including same (2017-11-07),
12. 9629249 - Component-embedded substrate and communication module (2017-04-18),

Title: Hirofumi Shinagawa: Innovating Component-Mounting Resin Substrates

Introduction

Hirofumi Shinagawa is a prominent inventor based in Nagaokakyo, Japan, with an impressive portfolio of 12 patents. His work focuses on advancing technologies related to resin substrates used in electronic components, showcasing his innovative contributions to the field.

Latest Patents

Among his latest innovations are several patents that revolve around resin substrates. One of his key patents describes a component-mounting resin substrate, which includes a thermoplastic resin body with a cavity designed for ultrasonic bonding. This method involves mounting a component on the resin substrate and enhancing the mounting area with a plating layer made from a material harder than the resin body. Another notable patent introduced by Shinagawa involves a component-embedded substrate that employs a multilayer body with insulating layers. This substrate features embedded components and planar conductors that overlap with the embedded components, showcasing a significant advancement in component integration.

Career Highlights

Hirofumi Shinagawa is an esteemed member of Murata Manufacturing Co., Ltd., where he utilizes his extensive knowledge and experience to drive innovation in electronic component technologies. His work has not only led to the development of key patents but has also established him as a leading figure in the innovative landscape of the electronics industry.

Collaborations

Throughout his career, Shinagawa has collaborated with notable colleagues, including Shigeru Tago and Yuki Wakabayashi. Their joint efforts reflect a commitment to pushing the boundaries of technology and enhancing the functionality of electronic devices through innovative substrate designs.

Conclusion

Hirofumi Shinagawa's contributions to the field of resin substrates reflect his dedication to innovation and excellence. With a solid foundation of patents and collaborations, he continues to play a vital role in shaping the future of electronics. His work not only enhances current technologies but also paves the way for future advancements in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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