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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10231342 B1

PDFFull Text
Date of Patent:
Mar. 12, 2019

Filed:

Apr. 14, 2017

Component built-in substrate

Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventors:

Shigeru Tago, Nagaokakyo, JP;

Hirofumi Shinagawa, Nagaokakyo, JP;

Yuki Wakabayashi, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Kyoto, JP;

Attorney:

Keating & Bennett, LLP

Primary Examiner:

Binh B Tran

Int. Cl.
CPC ...
H05K 5/00 (2006.01); H05K 7/00 (2006.01); H05K 1/18 (2006.01); H01L 23/538 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 3/46 (2006.01); H05K 1/16 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/186 (2013.01); H01L 23/5389 (2013.01); H05K 1/0313 (2013.01); H05K 1/09 (2013.01); H05K 1/111 (2013.01); H05K 1/185 (2013.01); H05K 3/4626 (2013.01); H05K 3/4644 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/19105 (2013.01); H05K 1/024 (2013.01); H05K 1/03 (2013.01); H05K 1/11 (2013.01); H05K 1/165 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/10 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10098 (2013.01); H05K 2203/063 (2013.01);
Abstract

A component built-in substrate incorporates a chip capacitor in a multilayer substrate including laminated base material layers made of thermoplastic resin. The chip capacitor includes an uneven portion including a recessed portion and a projected portion on one side in a laminated direction. On one side of the chip capacitor in the multilayer substrate, a density of low fluid member with a melting point higher than a fluidization temperature of the base material layers is higher in a region overlapping the recessed portion of the chip capacitor than in a region overlapping the projected portion of the chip capacitor when viewed in the lamination direction.

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