The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2019
Filed:
Mar. 01, 2017
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;
Inventors:
Assignee:
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 29/04 (2006.01); H01L 23/00 (2006.01); G01N 29/11 (2006.01); H01L 23/538 (2006.01); H01L 23/552 (2006.01); H01L 25/065 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
G01N 29/043 (2013.01); G01N 29/11 (2013.01); H01L 23/00 (2013.01); H01L 23/5383 (2013.01); H01L 23/5384 (2013.01); H01L 23/552 (2013.01); H01L 24/16 (2013.01); H01L 25/0657 (2013.01); H05K 1/0218 (2013.01); H05K 1/0269 (2013.01); G01N 2291/015 (2013.01); G01N 2291/048 (2013.01); G01N 2291/2697 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/16227 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06555 (2013.01); H01L 2924/14 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/3512 (2013.01); H05K 1/185 (2013.01); H05K 2203/0285 (2013.01);
Abstract
A component-embedded substrate includes a multilayer body including a plurality of insulating layers stacked in a stacking direction, an embedded component embedded in the multilayer body, and planar conductors disposed on both sides of the embedded component in the stacking direction, the planar conductors overlapping the embedded component. The planar conductors each include a plurality of openings that overlap the embedded component over substantially the entire region occupied by the embedded component, as seen in the stacking direction.