The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2017
Filed:
Nov. 12, 2015
Murata Manufacturing Co., Ltd., Kyoto, JP;
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Abstract
A component-embedded substrate includes a first embedded component positioned in a layer close to a mounting electrode and a second embedded component positioned in a layer farther away from the mounting electrode than the first embedded component. The first and second embedded components include electrically connected terminals. Each resin film of the substrate is formed of thermoplastic resin. The first embedded component has more terminals than the second embedded component. Many of the internal wires from the first and second embedded component extend towards a mounting surface where the mounting electrode is provided. However, since in plan view the area of the first embedded component is smaller than the second embedded component, and the first embedded component is disposed closer to the mounting surface than the second embedded component, there is space for routing the internal wires at the side of the mounting surface of the substrate.