The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 20, 2018

Filed:

Mar. 06, 2017
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventors:

Shigeru Tago, Nagaokakyo, JP;

Hirofumi Shinagawa, Nagaokakyo, JP;

Yuki Wakabayashi, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 23/64 (2006.01); H01L 21/48 (2006.01); H01L 23/66 (2006.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49822 (2013.01); H01L 21/4857 (2013.01); H01L 21/4867 (2013.01); H01L 23/49838 (2013.01); H01L 23/642 (2013.01); H01L 23/66 (2013.01); H01L 24/16 (2013.01); H01L 2021/60195 (2013.01); H01L 2223/6644 (2013.01); H01L 2223/6661 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16235 (2013.01);
Abstract

A substrate for a stacked module includes a stacked insulator in which a plurality of insulator layers mainly composed of a thermoplastic resin are stacked, a conductor pattern arranged along the plurality of insulator layers in the stacked insulator, an embedded component connected to the conductor pattern, a pad provided on a surface of the stacked insulator and configured to be ultrasonically bonded to a bump of a mounted component to be mounted on the surface of the stacked insulator, and an auxiliary conductor pattern between the pad and the embedded component and extending in a range that covers the pad and the embedded component as viewed in a stacking direction of the plurality of insulator layers.


Find Patent Forward Citations

Tago, Shigeru. (2018). Substrate for stacked module, stacked module, and method for manufacturing stacked module (U.S. Patent No. 9922918). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9922918

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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