The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 26, 2017

Filed:

Jul. 20, 2016
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventors:

Shigeru Tago, Nagaokakyo, JP;

Hirofumi Shinagawa, Nagaokakyo, JP;

Masaki Kawata, Nagaokakyo, JP;

Yuki Ito, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/11 (2006.01); H05K 3/32 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H05K 1/11 (2013.01); H05K 1/111 (2013.01); H05K 1/118 (2013.01); H05K 3/32 (2013.01); H05K 3/328 (2013.01); H05K 1/0393 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/05 (2013.01); H05K 2203/0285 (2013.01); Y02P 70/611 (2015.11);
Abstract

A module component includes a substrate including a liquid crystal polymer resin sheet, and an electronic component mounted on the substrate by ultrasonic bonding, wherein the electronic component includes a plurality of first substrate connecting electrodes including respective planar conductors provided on a substrate mounting surface separately from each other, and connected at a same potential or substantially a same potential, and the substrate includes a first component connecting electrode including a planar conductor provided on a component loading surface, and bonded to the plurality of first substrate connecting electrodes.


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