The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2020
Filed:
Feb. 26, 2018
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;
Inventors:
Assignee:
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/12 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 23/48 (2006.01); H05K 3/32 (2006.01); H05K 1/02 (2006.01); H01L 23/13 (2006.01); H05K 1/03 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H01L 23/12 (2013.01); H01L 23/48 (2013.01); H01L 23/4985 (2013.01); H01L 24/81 (2013.01); H05K 1/02 (2013.01); H05K 3/32 (2013.01); H05K 3/328 (2013.01); H01L 23/13 (2013.01); H01L 23/49816 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2224/1329 (2013.01); H01L 2224/13101 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/8185 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81207 (2013.01); H01L 2224/81801 (2013.01); H01L 2924/15151 (2013.01); H01L 2924/15159 (2013.01); H05K 1/0271 (2013.01); H05K 1/0274 (2013.01); H05K 1/0326 (2013.01); H05K 3/4697 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/0949 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/09072 (2013.01); H05K 2201/09781 (2013.01); H05K 2201/09845 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10553 (2013.01); H05K 2201/2009 (2013.01);
Abstract
A component-mounting resin substrate includes a resin substrate and a component. The resin substrate includes a thermoplastic resin body. The component is mounted on the resin substrate by ultrasonic bonding. In a mounting area of the resin body in which the component is mounted, a cavity that is hollowed from a mounting surface on which the component is mounted is defined. A plating layer that includes a material harder than the resin body is disposed on at least a portion of a wall surface of the cavity.