Hideyuki Ichiyama

This inventor holds 10 USPTO granted patents. Top assignees: Mitsubishi Denki Kabushiki Kaisha, Ryoden Semiconductor System Eengineering Corporation, Ryoden Semiconductor System Engineering Corporation. Active years: 1990-1999.

USPTO Granted Patents = 10

% Patents Active = 100.0

Average Co-Inventor Count = 2.7

ph-index = 8

Forward Citations = 672(Granted Patents)

Location History:

Kikuchi-gun, JP (1997)
Tokyo, JP (1998)
Itami, JP (1990 - 1999)

Company Filing History:

9 out of 21,351

Mitsubishi Denki Kabushiki Kaisha

patents

1 out of 1

Ryoden Semiconductor System Eengineering Corporation

patent

1 out of 52

Ryoden Semiconductor System Engineering Corporation

patents

where one patent can have more than one assignee

Years Active: 1990-1999

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10 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 5900582 - Lead frame including frame-cutting slit for lead-on-chip (LOC) (1999-05-04),

2. 5814883 - Packaged semiconductor chip (1998-09-29),

3. 5763829 - Leadframe including frame-cutting slit for lead-on-chip (LOC) (1998-06-09),

4. 5724726 - Method of making leadframe for lead-on-chip (LOC) semiconductor device (1998-03-10),

5. 5592019 - Semiconductor device and module (1997-01-07),

6. 5535509 - Method of making a lead on chip (LOC) semiconductor device (1996-07-16),

7. 5373190 - Resin-sealed semiconductor device (1994-12-13),

8. 5372295 - Solder material, junctioning method, junction material, and (1994-12-13),

9. 5207102 - Semiconductor pressure sensor (1993-05-04),

10. 4974052 - Plastic packaged semiconductor device (1990-11-27),

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