The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 13, 1994
Filed:
Feb. 27, 1992
Applicant:
Inventor:
Hideyuki Ichiyama, Itami, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257737 ; 257778 ; 257787 ;
Abstract
A resin-sealed semiconductor device includes and has a size that is substantially the same as a semiconductor element. The semiconductor device is easily handled and highly reliable. First ends of terminals made of a conductor, such as copper or the like, are respectively electrically connected to corresponding electrodes of the semiconductor element. The semiconductor element is sealed with a sealing resin so that second ends of the terminals are exposed at the surface of the sealing resin. Since the terminals are strong and are not easily damaged, there are no voids and a highly reliable semiconductor device is achieved.