The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 1998
Filed:
Jul. 25, 1995
Yoshihiro Tomita, Itami, JP;
Naoto Ueda, Itami, JP;
Yoshirou Nishinaka, Itami, JP;
Shunichi Abe, Itami, JP;
Hideyuki Ichiyama, Itami, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
A high-reliability semiconductor device and a method of producing the device. Absorption of moisture into a semiconductor device is effectively avoided by using a hard solder material, such as common solder having no moisture absorption, for die-bonding a semiconductor chip to a die pad. Thus, in the semiconductor device in accordance with the present inventions there are no corrosion problems nor package-cracking due to absorbed moisture.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile