The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 1998
Filed:
May. 01, 1996
Applicant:
Inventors:
Akiyoshi Sawai, Tokyo, JP;
Kisamitsu Ono, Tokyo, JP;
Hideyuki Ichiyama, Tokyo, JP;
Katsunori Asai, Itami, JP;
Assignees:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Ryoden Semiconductor System Eengineering Corporation, Hyogo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
257712 ; 257700 ; 257706 ; 257707 ; 257675 ; 257717 ; 257720 ; 257704 ; 257738 ;
Abstract
A semiconductor device includes a substrate having a recess; a semiconductor chip disposed in the recess; a plurality of external electrodes disposed on the substrate; a lid covering the recess; and a heat radiator disposed between the semiconductor chip and the substrate for transmitting heat generated by the semiconductor chip to the substrate for radiation.