Hideyasu Murooka

Title: Innovations of Hideyasu Murooka

Introduction

Hideyasu Murooka is a notable inventor based in Yokohama, Japan. He has made significant contributions to the field of multilayer wiring board fabrication, holding a total of six patents. His work focuses on enhancing the efficiency and cost-effectiveness of wiring board production.

Latest Patents

Murooka's latest patents include a multilayer wiring board fabricating method. This method involves applying a solvent-free fluid polymer precursor onto a wiring layer of a base substrate. The process ensures that the spaces among the wirings are filled with the precursor, which is then hardened under hydrostatic pressure. This innovative approach allows for the formation of highly dense wiring with vertical via conductors for inter-layer connections. Another significant patent is the process for fabricating an interconnected multilayer board. This process includes forming a metallic under-conductive layer on a base substrate and creating a two-level structure of conductor and via-hole layers. The resulting structure is filled with a solventless varnish that is cured, enhancing the board's integrity.

Career Highlights

Murooka has worked with prominent companies such as Hitachi, Ltd. and Hitachi Techno Engineering Co., Ltd. His experience in these organizations has contributed to his expertise in the field of electrical engineering and wiring technologies.

Collaborations

Some of Murooka's notable coworkers include Masayuki Kyooi and Naoya Kitamura. Their collaboration has likely fostered innovative ideas and advancements in their respective projects.

Conclusion

Hideyasu Murooka's contributions to the field of multilayer wiring board fabrication demonstrate his commitment to innovation and efficiency. His patents reflect a deep understanding of the complexities involved in electrical engineering. Murooka's work continues to influence the industry and pave the way for future advancements.