The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 26, 1993
Filed:
Oct. 09, 1990
Akimi Miyashita, Toride, JP;
Mutsumasa Fujii, Tsuchiura, JP;
Minoru Kubosawa, Kashiwa, JP;
Keiichiro Torii, Nagareyama, JP;
Nobuaki Ooki, Hadano, JP;
Kiyonori Kogawa, Hiratsuka, JP;
Masami Kawaguchi, Hadano, JP;
Hideyasu Murooka, Yokohama, JP;
Masayuki Kyooi, Yokohama, JP;
Hitachi, Ltd., Tokyo, JP;
Hitachi Techno Engineering Co., Ltd., Tokyo, JP;
Abstract
A hot press including a displaceable sleeve for surrounding materials of a multi-layer substrate under a reduced pressure condition, a gas pressurizing condition and a heating condition with thermal plates. Upper and lower sealing units seal an interior of the sleeve, with a mechanism lowering and raising the sleeve. A pilot check mechanism prevents a lower bolster from raising/lowering upon the reduced pressure condition and the gas pressure condition, and a retainer maintains the lowered or raised condition of the sleeve. The multi-layer substrate is formed under the reduced pressure condition and the gas pressure condition. Accordingly, the atmosphere and moisture between the materials of the multi-layer substrate and volatile composition are removed. Additionally, a void generated during the heat and pressure process by the heating plates is eliminated from the multi-layer substrate. By carrying out the formation of the multi-layer substrate at the heat and pressure by the heating plates under the gas pressure condition, a final dimensional precision and shape are enhanced and a warpage or twist is suppressed.