The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 13, 1990
Filed:
Mar. 31, 1989
Hideyasu Murooka, Yokohama, JP;
Masayuki Kyooi, Yokohama, JP;
Osamu Yamada, Yokohama, JP;
Noriaki Ujiie, Hadano, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A method and an apparatus of forming a multilayer printed circuit board which can positively remove voids in the prepregs in the printed board and enhance the reliability of the produced printed circuit board and is superior in economy, wherein a laminated assembly of a plurality of printed circuit board components and a plurality of prepregs alternately laminated on each other is sandwiched between upper and lower jig plates, and the laminated assembly sandwiched between the jig plates is clamped between heating plates of a bonding press to heat the assembly to a predetermined temperature, and, thereafter, a pressure is applied to the upper and lower jig plates so as to urge them against each other for bonding the printed circuit board component and the prepregs. An exterior pressurizing means is provided around the printed circuit board components and the prepregs sandwiched between the upper and lower jig plates in order to prevent the molten prepregs from flowing outwardly, thereby raising the fluid pressure of the molten prepregs to squeeze out air bubbles existing in the prepregs.