The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 1985
Filed:
Apr. 16, 1984
Osamu Yamada, Yokohama, JP;
Hideyasu Murooka, Yokohama, JP;
Kaoru Ono, Hadano, JP;
Akimi Miyashita, Toride, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A hot press capable of minimizing a displacement of one substrate from another in multilayer printed circuit boards each constituted by a plurality of substrates having wiring pattern groups printed thereon which are pressed together by applying pressure into a multilayer printed circuit board. The end is attained by minimizing a variation in thickness from a central portion of the board to a peripheral portion thereof. The hot press includes plate thickness adjusting devices each interposed between each bolster and each heat insulating member to compress and deform the heat insulating members beforehand. By imparting a deformation beforehand to each heat insulating member, contacting surfaces of the heat insulating members become substantially planer when they are compressed as pressure is applied to the substrates to press them together into a multilayer printed circuit board, thereby minimizing the variation in thickness from one portion to another in the multilayer printed circuit board produced by the hot press.