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Hideo Senoo

This inventor holds 19 USPTO granted patents and 8 EPO patents. Top assignees: Lintec Corporation, Sony Corporation, Other. Active years: 1998-2009.

USPTO Granted Patents = 19

% Patents Active = 78.9

EPO Patents = 8 (Patent Applications = 2)

Average Co-Inventor Count = 2.9

ph-index = 11

Forward Citations = 320(Granted Patents)

Location History:

Wako, JP (1998 - 2000)
Wakou, JP (2001)
Saitama, JP (2002 - 2007)
Kawaguchi, JP (2001 - 2009)

Company Filing History:

1 out of 834,453

Other

patents

where one patent can have more than one assignee

Years Active: 1998-2009

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19 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7589130 - Coating composition, coating film, method of manufacturing coating film, and optical recording medium (2009-09-15),

2. 7408259 - Sheet to form a protective film for chips (2008-08-05),

3. 7384676 - Coating composition, hard coat film, and optical disk (2008-06-10),

4. 7361971 - Semiconductor wafer protection structure and laminated protective sheet for use therein (2008-04-22),

5. 7235465 - Process for producing semiconductor chips having a protective film on the back surface (2007-06-26),

6. 7169648 - Process for producing a semiconductor device (2007-01-30),

7. 7135224 - Adhesive tape (2006-11-14),

8. 6919262 - Process for producing semiconductor chips (2005-07-19),

9. 6855418 - Tape for forming resin tie bar, resin tie bar, lead frame equipped with resin tie bar, resin-molded semiconductor device, and method for producing same (2005-02-15),

10. 6765289 - Reinforcement material for silicon wafer and process for producing IC chip using said material (2004-07-20),

11. 6656819 - Process for producing semiconductor device (2003-12-02),

12. 6558975 - Process for producing semiconductor device (2003-05-06),

13. 6544371 - Method of using a transfer tape (2003-04-08),

14. 6444310 - Dicing tape and a method of dicing a semiconductor wafer (2002-09-03),

15. 6297076 - Process for preparing a semiconductor wafer (2001-10-02),

Title: **Hideo Senoo: Innovator in Coating Technologies**

Introduction

Hideo Senoo, an accomplished inventor based in Kawaguchi, Japan, has an impressive portfolio consisting of 19 patents. His work primarily focuses on advanced coating compositions and films, showcasing innovations that have significant implications in various industrial applications.

Latest Patents

Among his latest patents, Senoo developed a innovative coating composition that incorporates a solvent and a coating agent featuring an ionizing radiation-curable compound as its principal component. This formulation allows for the application of a hard coating layer on protective films, adeptly concealing any projections or foreign bodies present on the surface, thereby achieving high surface smoothness. Additionally, he has contributed to the development of a sheet designed to form protective films for chips, which comprises a release sheet and a protective film forming layer that includes thermosetting and energy ray-curable components along with a binder polymer.

Career Highlights

Senoo has built a remarkable career with experience at Lintec Corporation, a leading provider of advanced materials. His work in this prestigious company has enabled him to contribute to significant advancements in coating technologies that are indispensable in various sectors.

Collaborations

Throughout his career, Hideo Senoo has collaborated with notable professionals in the field, including Takashi Sugino and Osamu Yamazaki. These collaborations have enhanced the breadth of innovation and research in coating technologies, further establishing Senoo's reputation as a leading inventor.

Conclusion

Hideo Senoo's contributions to the field of coating technology, coupled with his extensive patent portfolio, underscore his status as a prominent innovator. His latest patents exemplify the specialization and expertise that he brings to the industry, making a lasting impact on both protective film development and coating applications.

Profile summary based on public USPTO records.

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