The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 14, 2006
Filed:
Aug. 08, 2002
Takaji Sumi, Tokyo, JP;
Osamu Yamazaki, Saitama, JP;
Takashi Sugino, Kawaguchi, JP;
Hideo Senoo, Kawaguchi, JP;
Takaji Sumi, Tokyo, JP;
Osamu Yamazaki, Saitama, JP;
Takashi Sugino, Kawaguchi, JP;
Hideo Senoo, Kawaguchi, JP;
Lintec Corporation, Tokyo, JP;
Abstract
An adhesive tape comprising a base and, superimposed thereon, an adhesive layer, this adhesive layer comprising an adherent component (A), an epoxy resin (B), a thermally active latent epoxy resin curing agent (C), an energy radiation polymerizable compound (D) and a photopolymerization initiator (E), wherein either or both of the epoxy resin (B) and energy radiation polymerizable compound (D) have a dicyclopentadiene skeleton in its molecule or molecules thereof. The resultant adhesive tape has an adhesive layer which provides reduced water absorption of an adhesive curing product and which enables a lowering of the elastic modulus thereof during thermocompression bonding.