The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 15, 2005
Filed:
May. 17, 2002
Osamu Yamazaki, Saitama, JP;
Hideo Senoo, Kawaguchi, JP;
Kazuyoshi Ebe, Shiraoka-machi, JP;
LINTEC Corporation, Tokyo, JP;
Abstract
A resin tie barA is formed from a base materialof a heat-resistant resin whose melting point is higher than the temperature during resin molding and an insulative adhesive layeron the base materialand formed from an insulative adhesive agent that may or may not be removable prior to resin molding depending upon its composition. The resin tie barA is applied to the surface of the leadsof a lead frame, and resin molding is then performed, during which the resin tie barA is pressed by a heated moldwhich softens the insulative adhesive agent of the resin tie barA and pushes it into the gapsbetween the leadsof the lead frame. Thus the resin tie barA can be easily formed into a shape that is favorable for the leadsof the lead frame.