The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 22, 2008
Filed:
Aug. 21, 2003
Hideo Senoo, Kawaguchi, JP;
Koichi Nagamoto, Saitama, JP;
Katsuhiko Horigome, Saitama, JP;
Hitoshi Ohashi, Saitama, JP;
Hideo Senoo, Kawaguchi, JP;
Koichi Nagamoto, Saitama, JP;
Katsuhiko Horigome, Saitama, JP;
Hitoshi Ohashi, Saitama, JP;
Lintec Corporation, Tokyo, JP;
Abstract
A semiconductor wafer protection structure including a semiconductor wafer and a protective sheet overlaid on a circuit surface of the semiconductor wafer, wherein the protective sheet has a larger diameter than the outer diameter of the semiconductor wafer. Semiconductor wafer protection structures and methods, and laminated protective sheet for use therein are provided and enable prevention of damage to a wafer during grinding and transportation when the wafer is ground to an ultrathin thickness and transported. Also provided is a process for processing a semiconductor wafer whereby damage to the wafer can be reduced during application and cutting of an adhesive sheet.