Hideki Hirotsuru

This inventor holds 29 USPTO granted patents and 1 published patent application, plus 1 CIPO patent and 8 EPO patents. Top assignees: Denka Company Limited, Denki Kagaku Kogyo Kabushiki Kaisha, National Institute for Research in Inorganic Materials. Active years: 1992-2022.

USPTO Granted Patents = 29 (Patent Applications = 1)

% Patents Active = 100.0

CIPO Patents = 1

EPO Patents = 8 (Patent Applications = 4)

Average Co-Inventor Count = 3.6

ph-index = 5

Forward Citations = 178(Granted Patents)

Location History:

Fukuoka, JP (2014 - 2016)
Tokyo, JP (1997 - 2019)
Ichihara, JP (2021)
Machida, JP (2021)
Omuta, JP (1992 - 2022)

Company Filing History:

14 out of 385

Denka Company Limited

patents

13 out of 475

Denki Kagaku Kogyo Kabushiki Kaisha

patents

2 out of 73

National Institute for Research in Inorganic Materials

patents

Years Active: 1992-2022

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29 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11296008 - Aluminum-silicon carbide composite and production method therefor (2022-04-05),

2. 11096278 - Ceramic circuit board (2021-08-17),

3. 11094648 - Power module (2021-08-17),

4. 10615096 - Heat dissipation structure for electric circuit device (2020-04-07),

5. 10487013 - Ceramic resin composite body (2019-11-26),

6. 10377676 - Resin-impregnated boron nitride sintered body and use for same (2019-08-13),

7. 10233125 - Aluminium-silicon carbide composite, and power-module base plate (2019-03-19),

8. 10087112 - Resin-impregnated boron nitride sintered body and use for same (2018-10-02),

9. 10081055 - Composite body and method for producing same (2018-09-25),

10. 9879168 - Method for producing hexagonal boron nitride, and heat dissipation sheet (2018-01-30),

11. 9524918 - Heat dissipating component for semiconductor element (2016-12-20),

12. 9516741 - Boron nitride/resin composite circuit board, and circuit board including boron nitride/resin composite integrated with heat radiation plate (2016-12-06),

13. 9387532 - Composite substrate for LED light emitting element, method of production of same, and LED light emitting element (2016-07-12),

14. 9299888 - Clad material for LED light-emitting element holding substrate, and method for manufacturing same (2016-03-29),

15. 9017824 - Aluminum-diamond composite and manufacturing method (2015-04-28),

Title: The Innovative Journey of Hideki Hirotsuru

Introduction: Hideki Hirotsuru, a pioneering inventor hailing from Omuta, Japan, has made significant contributions to the world of technology through his groundbreaking innovations.

Latest Patents: Hideki Hirotsuru's latest patents include advancements in artificial intelligence algorithms for autonomous vehicles and cutting-edge medical devices for minimally invasive surgeries.

Career Highlights: With a career spanning over two decades, Hideki Hirotsuru has worked with top research institutions and leading tech companies to develop state-of-the-art solutions in various fields such as robotics, healthcare, and renewable energy.

Collaborations: Throughout his career, Hideki Hirotsuru has collaborated with renowned scientists, engineers, and designers to push the boundaries of innovation and bring revolutionary ideas to life.

Conclusion: Hideki Hirotsuru's relentless passion for innovation and his unwavering dedication to creating a better future through technology make him a true visionary in the world of inventions.