The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 17, 2021
Filed:
Jul. 30, 2018
Applicant:
Denka Company Limited, Tokyo, JP;
Inventors:
Atsushi Sakai, Machida, JP;
Hideki Hirotsuru, Machida, JP;
Kohki Ichikawa, Machida, JP;
Yoshitaka Taniguchi, Omuta, JP;
Assignee:
DENKA COMPANY LIMITED, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 1/05 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0306 (2013.01); H05K 1/053 (2013.01); H05K 2201/068 (2013.01);
Abstract
A ceramic circuit board includes a ceramic substrate and metal layers provided to both surfaces of the ceramic substrate and containing Al and/or Cu, wherein a measurement value α1 of a linear thermal expansion coefficient at 25° C. to 150° C. is 5×10to 9×10/K, a ratio α1/α2 of the α1 to a theoretical value α2 of the linear thermal expansion coefficient at 25° C. to 150° C. is 0.7 to 0.95, and at least one of the metal layers forms a metal circuit.