logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9017824 B1

PDFFull Text
Date of Patent:
Apr. 28, 2015

Filed:

Jul. 08, 2009

Aluminum-diamond composite and manufacturing method

Applicants:

Hideki Hirotsuru, Omuta, JP;

Hideo Tsukamoto, Omuta, JP;

Inventors:

Hideki Hirotsuru, Omuta, JP;

Hideo Tsukamoto, Omuta, JP;

Assignee:

Denki Kagaku Kogyo Kabushiki Kaisha, Tokyo, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Jonathan Langman

Int. Cl.
CPC ...
B32B 3/10 (2006.01); B32B 27/32 (2006.01); G11B 11/105 (2006.01); C03C 27/00 (2006.01); B32B 15/01 (2006.01); B23P 9/00 (2006.01); B32B 9/00 (2006.01); B22C 3/00 (2006.01); B22D 19/14 (2006.01); B22D 19/00 (2006.01); C22C 26/00 (2006.01); B22F 3/26 (2006.01); B22F 7/04 (2006.01); H01L 23/373 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
C22C 26/00 (2013.01); B22F 3/26 (2013.01); B22F 7/04 (2013.01); B22F 2998/00 (2013.01); B22F 2998/10 (2013.01); H01L 21/4882 (2013.01); H01L 23/3732 (2013.01); H01L 23/3735 (2013.01); C22C 2204/00 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Disclosed is an aluminum-diamond composite having both high thermal conductivity and thermal expansion coefficient close to those of semiconductor elements, which is improved in platability in the surface and surface roughness so that the composite becomes suitable for use as a heat sink of a semiconductor element of the like. Specifically disclosed is a plate-like aluminum-diamond composite containing diamond particles and a metal mainly composed of aluminum. The aluminum-diamond composite is composed of a composite part and surface layers formed on both sides of the composite part, and the surface layers are composed of a material containing a metal mainly composed of aluminum. The diamond particle content is 40-70% by volume of the entire aluminum-diamond composite.

Find Patent Forward Citations

Loading…