The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2016

Filed:

Feb. 10, 2010
Applicants:

Hideki Hirotsuru, Omuta, JP;

Hideo Tsukamoto, Omuta, JP;

Yosuke Ishihara, Omuta, JP;

Inventors:

Hideki Hirotsuru, Omuta, JP;

Hideo Tsukamoto, Omuta, JP;

Yosuke Ishihara, Omuta, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/64 (2010.01); C04B 41/88 (2006.01); B22D 18/02 (2006.01); C04B 41/00 (2006.01); C04B 41/52 (2006.01); C04B 41/90 (2006.01); B22F 3/26 (2006.01); C22C 26/00 (2006.01); C22C 29/06 (2006.01); C22C 29/12 (2006.01); C22C 29/16 (2006.01);
U.S. Cl.
CPC ...
B22D 18/02 (2013.01); B22F 3/26 (2013.01); C04B 41/009 (2013.01); C04B 41/52 (2013.01); C04B 41/90 (2013.01); C22C 26/00 (2013.01); C22C 29/06 (2013.01); C22C 29/12 (2013.01); C22C 29/16 (2013.01); B22F 2998/10 (2013.01); H01L 33/641 (2013.01); H01L 2924/0002 (2013.01); Y10T 428/12007 (2015.01);
Abstract

A substrate for an LED light emitting element having a small difference of linear thermal expansion coefficient with the III-V semiconductor crystal constituting an LED, having an excellent thermal conductivity, and suitable for high output LEDs. A porous body comprises one or more materials selected from silicon carbide, aluminum nitride, silicon nitride, diamond, graphite, yttrium oxide, and magnesium oxide and has a porosity that is 10 to 50 volume % and a three-point bending strength that is 50 MPa or more. The porous body is infiltrated, by means of liquid metal forging, with aluminum alloy or pure aluminum at an infiltration pressure of 30 MPa or more, cut and/or ground to a thickness of 0.05 to 0.5 mm and to a surface roughness (Ra) of 0.01 to 0.5 μm, then is formed with a metal layer comprising one or more elements selected from Ni, Co, Pd, Cu, Ag, Au, Pt and Sn on its surface to a thickness of 0.5 to 15 μm, so as to thereby produce the composite substrate for the LED light emitting element.


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