Hyogo, Japan

Hideki Genjo

This inventor holds 8 USPTO granted patents. Top assignees: Mitsubishi Denki Kabushiki Kaisha, Renesas Technology Corp.. Active years: 1991-2004.


% Patents Active = 100.0

Average Co-Inventor Count = 4.9

ph-index = 6

Forward Citations = 130(Granted Patents)


Location History:

  • Tokyo, JP (2000)
  • Hyogo, JP (1991 - 2004)

Company Filing History:


Years Active: 1991-2004

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8 patents (USPTO):Explore Patents

Title: Innovations of Inventor Hideki Genjo

Introduction

Hideki Genjo is a prominent inventor based in Hyogo, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 8 patents. His work focuses on enhancing the performance and miniaturization of semiconductor devices.

Latest Patents

One of his latest patents is a semiconductor device having an interconnection structure. This invention addresses the challenge of reducing the diameter of contact holes in semiconductor devices. By incorporating an anti-HF side wall film, which is not etched by hydrofluoric acid, he has improved the stability of operation characteristics in miniaturized semiconductor devices. Another notable patent is for a semiconductor device featuring a metallic fuse member and a cutting method. This device includes fuse members made of metal that can be cut by laser light, ensuring precise operation and alignment.

Career Highlights

Throughout his career, Hideki Genjo has worked with notable companies such as Mitsubishi Electric Corporation and Renesas Technology Corporation. His experience in these organizations has allowed him to develop innovative solutions in semiconductor technology.

Collaborations

He has collaborated with esteemed colleagues, including Yoshinori Okumura and Ikuo Ogoh, contributing to advancements in their respective fields.

Conclusion

Hideki Genjo's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence the development of more efficient and miniaturized semiconductor devices.

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