The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 19, 2000

Filed:

May. 04, 1998
Applicant:
Inventors:

Shigeru Shiratake, Tokyo, JP;

Hideki Genjo, Tokyo, JP;

Yasuhiro Ido, Tokyo, JP;

Atsushi Hachisuka, Tokyo, JP;

Koji Taniguchi, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257529 ; 257530 ; 257209 ; 438281 ;
Abstract

A semiconductor device has a plurality of fuse members (1a, 1b) composed of a metal that can be cut by laser light (4), disposed over a semiconductor substrate (5). The length L of the fuse members (1a, 1b) is smaller than a value obtained by subtracting an alignment error .alpha. of the laser light (4) from a spot diameter D of the laser light (4), i.e., the value (D-.alpha.). The fuse members (1a, 1b) are spaced a distance l larger than a value obtained by adding the alignment error .alpha. to the half of the spot diameter D, i.e., the value (D/2+.alpha.).


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