Hideharu Aoyama

Title: Innovations by Inventor Hideharu Aoyama

Introduction

Hideharu Aoyama is a notable inventor based in Tokyo, Japan, recognized for his contributions to the field of automated processing systems. With a total of four patents to his name, Aoyama has made significant strides in enhancing the efficiency of substrate processes.

Latest Patents

Aoyama's latest innovations include a "Substrate Transporter and Substrate Processing Apparatus," which aims to provide an automated solution for conveying rectangular substrates. This invention features a sophisticated system comprising multiple conveyance rollers, roller shafts, a motor, and a pusher. The plurality of conveyance rollers is designed to support the substrate's lower surface, while the motor facilitates the rotation of roller shafts. Additionally, the pusher mechanism ensures the substrate is accurately lifted and separated from the rollers, allowing for smooth transportation.

Another key patent is the "Plating Support System, Plating Support Device, and Recording Medium." This system incorporates a simulator that predicts the uniformity of a plating film based on various electroplating treatment conditions. It utilizes numerical analysis data and regression analysis to ascertain optimal implement conditions, thus improving the quality and uniformity of the electroplating process.

Career Highlights

Hideharu Aoyama is affiliated with Ebara Corporation, a leading company specializing in advanced technology solutions. Over his career, Aoyama has contributed to numerous innovative projects that enhance substrate processing and plating methodologies.

Collaborations

Throughout his professional journey, Aoyama has collaborated with esteemed colleagues, including Masayuki Fujiki and Yoshitaka Mukaiyama. These collaborations have fostered an environment of creativity and innovation, furthering the development of cutting-edge technologies in their field.

Conclusion

In summary, Hideharu Aoyama's inventive work, particularly in automated substrate processing and electroplating systems, demonstrates his commitment to technological advancement. His patents not only illustrate his ingenuity but also contribute significantly to the industry, promising enhanced efficiency and quality in substrate management.