Ebara Corporation

Hideharu Aoyama

Kenichi Kobayashi

Asagi Matsugu

Akihiro Yazawa

Masayuki Fujiki

Tetsuji Togawa

Jumpei Fujikata

Masashi Shimoyama

Makoto Kashiwagi

Tsutomu Nakada

Ryuya Koizumi

Yoshitaka Mukaiyama

Takashi Mitsuya

Kenichi Akazawa

Mitsuhiro Shamoto

Yasuyuki Miyasawa

Takahiro Nanjo

Fong-Jie Du

Manato Furusawa

Tsuyoshi Soma

Ayumu Saito

Yusuke Sasaya

Keiichi Nojo

Takashi Koba

To achieve a cleaning module and a substrate processing apparatus that can improve the cleaning capability for a substrate with a simple structure. A cleaning module includes a first transfer mechanism-, an ultrasonic cleaning tank, a transfer machine, and a second transfer mechanism-. The first transfer mechanism-is for transferring a substrate WF with a surface to be polished facing downward up to a substrate grip or release positionon a downstream side along a transfer passage. The ultrasonic cleaning tankis disposed at a position spaced apart from the transfer passageand is for cleaning a substrate WF with the surface to be polished facing downward. The transfer machineis for transferring the substrate WF between the substrate grip or release positionof the transfer passageand the ultrasonic cleaning tank. The second transfer mechanism-is for transferring the substrate WF transferred to the substrate grip or release positionfrom the ultrasonic cleaning tankby the transfer machineto further downstream along the transfer passage

Transfer apparatus, cleaning module, and substrate processing apparatus

To provide an automated apparatus for conveying a rectangular substrate. According to one embodiment, there is provided a substrate conveying apparatus for conveying the rectangular substrate. The substrate conveying apparatus includes a plurality of conveyance rollers, a plurality of roller shafts, a motor, and a pusher. The plurality of conveyance rollers are configured to support a lower surface of the substrate. To the plurality of roller shafts, the plurality of conveyance rollers are mounted. The motor is configured to rotate the plurality of roller shafts. The pusher is for lifting the substrate on the plurality of conveyance rollers such that the substrate is separated away from the plurality of conveyance rollers. The pusher includes a stage configured to pass through a clearance between the plurality of roller shafts.

Substrate transporter and substrate processing apparatus including substrate transporter

A plating support system is provided and includes a simulator that predicts an in-plane uniformity value of a plating film formed on a substrate based on assumed conditions for an electroplating treatment of the substrate; a numerical analysis data storage unit that stores numerical analysis data in which each assumed condition is associated with the in-plane uniformity value for plural assumed conditions; a regression analysis unit that estimates a model that the in-plane uniformity value is an objective variable and variables of assumed conditions are explanatory variables by regression analysis based on the numerical analysis data; and an implement condition search unit that uses the estimated model to search for implement conditions that are recommended values of the assumed conditions related to the in-plane uniformity of the plating film formed in the electroplating treatment of the substrate to be plated.

Plating support system, plating support device, and recording medium

There are provided a plating apparatus and a plating method enabling continuous operation even while a stocker is taken out of the plating apparatus. The plating apparatus includes a plating treatment section performing plating on a substrate and a plurality of stockers configured to be able to store a holder configured to hold a substrate or an anode. At least one of the plurality of stockers is configured to be movable into and out of the plating apparatus.

Plating apparatus and plating method

A method is provided, the method including: repeatedly acquiring a state of one or more devices included in the semiconductor manufacturing apparatus; providing a first animation indicating an operation of the semiconductor manufacturing apparatus by displaying at least an image indicating the state of one or more devices on a display unit each time the state is acquired; storing, in a memory, the acquired state of one or more devices and a time related to the state; receiving an input for switching a display mode; and providing a second animation of the semiconductor manufacturing apparatus by displaying, one by one on the display unit, at least one or more images respectively indicating the state of one or more devices related to one or more times including a reference time stored in the memory, after receiving the input for switching a display mode.

Method of controlling display of operation of semiconductor manufacturing apparatus and non-transitory computer readable storage medium therefor, and system for performing display concerning operation of semiconductor manufacturing apparatus

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Tokyo, Japan

Hideharu Aoyama