The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 02, 2025

Filed:

Oct. 25, 2021
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Asagi Matsugu, Tokyo, JP;

Akihiro Yazawa, Tokyo, JP;

Manato Furusawa, Tokyo, JP;

Hideharu Aoyama, Tokyo, JP;

Ayumu Saito, Tokyo, JP;

Yusuke Sasaya, Tokyo, JP;

Kenichi Kobayashi, Tokyo, JP;

Yasuyuki Miyasawa, Tokyo, JP;

Tsuyoshi Soma, Tokyo, JP;

Keiichi Nojo, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B08B 1/20 (2024.01); B08B 3/12 (2006.01); B24B 37/34 (2012.01);
U.S. Cl.
CPC ...
B08B 1/20 (2024.01); B08B 3/12 (2013.01); B24B 37/34 (2013.01);
Abstract

To achieve a cleaning module and a substrate processing apparatus that can improve the cleaning capability for a substrate with a simple structure. A cleaning module includes a first transfer mechanism-, an ultrasonic cleaning tank, a transfer machine, and a second transfer mechanism-. The first transfer mechanism-is for transferring a substrate WF with a surface to be polished facing downward up to a substrate grip or release positionon a downstream side along a transfer passage. The ultrasonic cleaning tankis disposed at a position spaced apart from the transfer passageand is for cleaning a substrate WF with the surface to be polished facing downward. The transfer machineis for transferring the substrate WF between the substrate grip or release positionof the transfer passageand the ultrasonic cleaning tank. The second transfer mechanism-is for transferring the substrate WF transferred to the substrate grip or release positionfrom the ultrasonic cleaning tankby the transfer machineto further downstream along the transfer passage


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