Company Filing History:
Years Active: 2018-2025
Title: Innovations by Yasuyuki Miyasawa
Introduction
Yasuyuki Miyasawa is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of substrate processing and cleaning technologies. With a total of 7 patents to his name, Miyasawa continues to push the boundaries of innovation in his industry.
Latest Patents
Miyasawa's latest patents include a transfer apparatus, a cleaning module, and a substrate processing apparatus. These inventions aim to enhance the cleaning capability for substrates while maintaining a simple structure. The cleaning module features a first transfer mechanism designed to transfer a substrate with its polished surface facing downward. It also includes an ultrasonic cleaning tank positioned away from the transfer passage for effective cleaning. The transfer machine facilitates the movement of the substrate between the grip or release position and the cleaning tank. Additionally, the second transfer mechanism ensures the substrate is moved downstream after cleaning. Another notable invention is a polishing apparatus that maintains a constant width of the polishing tool while polishing the peripheral portion of a substrate. This apparatus includes a substrate holder for rotating the substrate and a pressing pad that applies pressure to the polishing tool.
Career Highlights
Miyasawa is currently employed at Ebara Corporation, where he continues to innovate and develop new technologies. His work has significantly impacted the efficiency and effectiveness of substrate processing in various applications.
Collaborations
Miyasawa has collaborated with notable coworkers, including Masayuki Nakanishi and Kenji Kodera, contributing to the advancement of their shared projects.
Conclusion
Yasuyuki Miyasawa's contributions to substrate processing and cleaning technologies exemplify his commitment to innovation. His patents reflect a deep understanding of the industry's needs and a dedication to improving existing technologies.