The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 03, 2023
Filed:
Jan. 14, 2021
Ebara Corporation, Tokyo, JP;
Mitsuhiro Shamoto, Tokyo, JP;
Masashi Shimoyama, Tokyo, JP;
Tsutomu Nakada, Tokyo, JP;
Hideharu Aoyama, Tokyo, JP;
Masayuki Fujiki, Tokyo, JP;
EBARA CORPORATION, Tokyo, JP;
Abstract
A plating support system is provided and includes a simulator that predicts an in-plane uniformity value of a plating film formed on a substrate based on assumed conditions for an electroplating treatment of the substrate; a numerical analysis data storage unit that stores numerical analysis data in which each assumed condition is associated with the in-plane uniformity value for plural assumed conditions; a regression analysis unit that estimates a model that the in-plane uniformity value is an objective variable and variables of assumed conditions are explanatory variables by regression analysis based on the numerical analysis data; and an implement condition search unit that uses the estimated model to search for implement conditions that are recommended values of the assumed conditions related to the in-plane uniformity of the plating film formed in the electroplating treatment of the substrate to be plated.