Kanagawa, Japan

Hideaki Tsuchiya

This inventor holds 16 USPTO granted patents and 6 published patent applications and 3 EPO patents, primarily in Semiconductor Devices. Top assignees: Renesas Electronics Corporation, Fuji Jukogyo Kabushiki Kaisha. Active years: 1996-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hideaki Tsuchiya. Retrieved from https://idiyas.com/inventor/hideaki-tsuchiya

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 16 

% Patents Active = 93.8

 

Average Co-Inventor Count = 2.8

ph-index = 4

Forward Citations = 790(Granted Patents)


Location History:

  • Mitaka, JP (1996 - 2002)
  • Kanagawa, JP (2011 - 2018)
  • Tokyo, JP (2000 - 2024)

Company Filing History:


Years Active: 1996-2024

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Areas of Expertise:
Semiconductor Device
Package Substrate
Integrated Circuit
Wiring Layout
Interconnection Program
Information Display
Stereo Camera
Altitude Detection
Vehicle Safety
16 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Hideaki Tsuchiya

Introduction

Hideaki Tsuchiya is a prominent inventor based in Kanagawa, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 16 patents. His work has been instrumental in advancing the capabilities of semiconductor devices.

Latest Patents

Among his latest patents, Tsuchiya has developed a semiconductor device featuring an interlayer dielectric layer that covers an electric fuse element. This design includes a resistance layer made of silicon metal, which is strategically arranged above the electric fuse element. Another notable patent involves a semiconductor device that comprises a package substrate and a semiconductor chip. In this invention, the semiconductor chip is placed on the package substrate, which contains a first electrode pad and a first insulating film. The film is designed to expose a portion of the surface of the first electrode pad. The semiconductor chip also features a second electrode pad and a second insulating film, which exposes a portion of the surface of the second electrode pad. The second electrode pad is connected to the first electrode pad through a solder bump, with specific dimensions defined for optimal performance.

Career Highlights

Throughout his career, Tsuchiya has worked with notable companies such as Renesas Electronics Corporation and Fuji Jukogyo Kabushiki Kaisha. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking innovations in semiconductor technology.

Collaborations

Tsuchiya has collaborated with esteemed colleagues, including Shinji Yokogawa and Keiji Saneyoshi. These partnerships have fostered a creative environment that has led to the development of advanced technologies.

Conclusion

Hideaki Tsuchiya's contributions to semiconductor technology are noteworthy and impactful. His innovative patents and collaborations with industry leaders highlight his role as a significant figure in the field. His work continues to influence the future of semiconductor devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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