The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 2021
Filed:
Feb. 05, 2018
Renesas Electronics Corporation, Tokyo, JP;
Kenji Sakata, Tokyo, JP;
Toshihiko Akiba, Tokyo, JP;
Takuo Funaya, Tokyo, JP;
Hideaki Tsuchiya, Tokyo, JP;
Yuichi Yoshida, Tokyo, JP;
Renesas Electronics Corporation, Tokyo, JP;
Abstract
There is a need to improve reliability of the semiconductor device. A semiconductor device includes a printed circuit board and a semiconductor chip mounted over the printed circuit board. The semiconductor chip includes a pad, an insulation film including an opening to expose part of the pad, and a pillar electrode formed over the pad exposed from the opening. The printed circuit board includes a terminal and a resist layer including an opening to expose part of the terminal. The pillar electrode of the semiconductor chip and the terminal of the printed circuit board are coupled via a solder layer. Thickness hof the pillar electrode is measured from the upper surface of the insulation film. Thickness hof the solder layer is measured from the upper surface of the resist layer. Thickness his greater than or equal to a half of thickness hand is smaller than or equal to thickness h.