Heng-Ming Nien

Title: The Innovative Contributions of Heng-Ming Nien

Introduction

Heng-Ming Nien is a prominent inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of circuit board manufacturing, holding a total of 6 patents. His work focuses on enhancing the efficiency and functionality of circuit board structures.

Latest Patents

Heng-Ming Nien's latest patents include a manufacturing method for circuit board structures that involves a plurality of build-up layers. This method includes steps such as providing a carrier, forming a first build-up layer with a plurality of first circuits, and attaching a second build-up layer to a core layer. Notably, the first circuits are designed to be finer than the second circuits. Another significant patent is a comprehensive manufacturing method of circuit boards, which incorporates multiple substrates and conductive structures to define both ground and signal paths. This innovative approach enhances the electrical connectivity and performance of circuit boards.

Career Highlights

Heng-Ming Nien is currently employed at Unimicron Technology Corporation, where he continues to develop cutting-edge technologies in circuit board manufacturing. His expertise and innovative mindset have positioned him as a key player in the industry.

Collaborations

Throughout his career, Heng-Ming Nien has collaborated with notable colleagues, including Chih-Chiang Lu and Shih-Lian Cheng. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Heng-Ming Nien's contributions to circuit board technology exemplify the spirit of innovation. His patents and ongoing work at Unimicron Technology Corporation continue to shape the future of the industry.