The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2025
Filed:
Aug. 30, 2022
Applicant:
Unimicron Technology Corp., Taoyuan, TW;
Inventors:
Shao-Chien Lee, Taoyuan, TW;
Ching-Sheng Chen, Taoyuan, TW;
Heng-Ming Nien, Taoyuan, TW;
Pei-Wei Wang, Taoyuan, TW;
Assignee:
UNIMICRON TECHNOLOGY CORP., Taoyuan, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/46 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4679 (2013.01); H01L 21/4857 (2013.01); H01L 23/49822 (2013.01); H05K 1/0298 (2013.01); H05K 1/113 (2013.01); H05K 1/116 (2013.01); H05K 3/4046 (2013.01); H05K 3/4602 (2013.01); H05K 2203/016 (2013.01); H05K 2203/1131 (2013.01);
Abstract
A manufacturing method for circuit board structure includes steps of providing a carrier, forming a first build-up layer including a plurality of first circuits, forming a second build-up layer including a plurality of second circuits on a side of the first build-up layer located away from the carrier, attaching a side of the second build-up layer located away from the first build-up layer to a core layer, and removing the carrier from the first build-up layer, where the first circuits are finer than the second circuits.