The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 30, 2024
Filed:
Aug. 09, 2023
Unimicron Technology Corp., Taoyuan, TW;
Chih-Chiang Lu, Taoyuan, TW;
Heng-Ming Nien, Taoyuan, TW;
Ching-Sheng Chen, Hsinchu County, TW;
Ching Chang, Taoyuan, TW;
Ming-Ting Chang, New Taipei, TW;
Chi-Min Chang, Taoyuan, TW;
Shao-Chien Lee, Taipei, TW;
Jun-Rui Huang, Taoyuan, TW;
Shih-Lian Cheng, New Taipei, TW;
Unimicron Technology Corp., Taoyuan, TW;
Abstract
Provided is a manufacturing method of circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, and a conductive via structure. The third substrate has an opening and includes a first dielectric layer. The opening penetrates the third substrate, and the first dielectric layer fills the opening. Multiple conductive structures are formed so that the first substrate, the second substrate, the third substrate, and the fourth substrate are electrically connected through the conductive structures to define a ground path. A conductive via structure is formed to penetrate the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate. The conductive via structure is electrically connected to the first substrate and the fourth substrate to define a signal path, and the ground path surrounds the signal path.