The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 10, 2023
Filed:
Oct. 08, 2021
Unimicron Technology Corp., Taoyuan, TW;
Chih-Chiang Lu, Taoyuan, TW;
Heng-Ming Nien, Taoyuan, TW;
Ching-Sheng Chen, Hsinchu County, TW;
Ching Chang, Taoyuan, TW;
Ming-Ting Chang, New Taipei, TW;
Chi-Min Chang, Taoyuan, TW;
Shao-Chien Lee, Taipei, TW;
Jun-Rui Huang, Taoyuan, TW;
Shih-Lian Cheng, New Taipei, TW;
Unimicron Technology Corp., Taoyuan, TW;
Abstract
Provided is a circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, and a conductive via structure. The second substrate is disposed between the first substrate and the third substrate. The third substrate is disposed between the second substrate and the fourth substrate. The third substrate has an opening penetrating the third substrate and includes a first dielectric layer filling the opening. The conductive via structure penetrates the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate, and is electrically connected to the first substrate and the fourth substrate to define a signal path. The first substrate, the second substrate, the third substrate and the fourth substrate are electrically connected through the conductive structures to define a ground path, and the ground path surrounds the signal path.