The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2024
Filed:
Mar. 28, 2022
Applicant:
Unimicron Technology Corp., Taoyuan, TW;
Inventors:
Heng-Ming Nien, Taoyuan, TW;
Chih-Chiang Lu, Taoyuan, TW;
Chih-Kai Chan, Taoyuan, TW;
Shih-Lian Cheng, New Taipei, TW;
Assignee:
Unimicron Technology Corp., Taoyuan, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 5/00 (2006.01); C25D 21/12 (2006.01); H05K 3/18 (2006.01);
U.S. Cl.
CPC ...
C25D 5/007 (2020.08); C25D 21/12 (2013.01); H05K 3/188 (2013.01);
Abstract
An electroplating apparatus includes an anode and a cathode, a power supply, a regulating plate, and a controller. The power supply is electrically connected to the anode and the cathode. The regulating plate is disposed between the anode and the cathode. The regulating plate includes an insulation grid plate and a plurality of wires. The controller is electrically connected to the plurality of wires to control a state of an electromagnetic field around the plurality of wires. An electroplating method is also provided.