IDiyas

For the Inventor, By the Inventor

Perak, Malaysia

Hee Kong Phoon

USPTO Granted Patents = 15 


Average Co-Inventor Count = 3.6

ph-index = 4

Forward Citations = 39(Granted Patents)


Location History:

  • Perak, MY (2007 - 2014)
  • Bagan Serai, MY (2015 - 2020)
  • Bayan Lepas, MY (2021 - 2024)

Company Filing History:

goldMedal12 out of 4,283 
 
Altera Corporation
 patents
silverMedal3 out of 54,664 
 
Intel Corporation
 patents

Years Active: 2007-2025

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15 patents (USPTO):Explore Patents
1. 12394713 - Fabric die to fabric die interconnect for modularized integrated circuit devices (2025-08-19),
2. 12009298 - Fabric die to fabric die interconnect for modularized integrated circuit devices (2024-06-11),
3. 11670589 - Fabric die to fabric die interconnect for modularized integrated circuit devices (2023-06-06),
4. 10886218 - Fabric die to fabric die interconnect for modularized integrated circuit devices (2021-01-05),
5. 10686446 - Power gated lookup table circuitry (2020-06-16),
6. 9705504 - Power gated lookup table circuitry (2017-07-11),
7. 9047934 - Timing signal adjustment for data storage (2015-06-02),
8. 8863061 - Application-specific integrated circuit equivalents of programmable logic and associated methods (2014-10-14),
9. 8504963 - Application-specific integrated circuit equivalents of programmable logic and associated methods (2013-08-06),
10. 8291355 - Application-specific integrated circuit equivalents of programmable logic and associated methods (2012-10-16),
11. 7870513 - Application-specific integrated circuit equivalents of programmable logic and associated methods (2011-01-11),
12. 7733121 - Methods and apparatus for programmably powering down structured application-specific integrated circuits (2010-06-08),
13. 7305640 - Programmable soft macro memory using gate array base cells (2007-12-04),
14. 7304497 - Methods and apparatus for programmably powering down structured application-specific integrated circuits (2007-12-04),
15. 7304496 - Mask-programmable logic device with programmable input/output ports (2007-12-04),

Title: Hee Kong Phoon - Innovator in Integrated Circuit Technology

Introduction

Hee Kong Phoon is a distinguished inventor based in Perak, Malaysia, known for his significant contributions to the field of integrated circuit technology. With a remarkable portfolio of 15 patents, he has made strides in developing innovative solutions that enhance the functionality and efficiency of modularized integrated circuits.

Latest Patents

His latest patent, titled "Fabric die to fabric die interconnect for modularized integrated circuit devices," introduces a programmable fabric die that features a direct interconnect interface column. This design allows for low latency connections between fabric dies, effectively reducing routing congestion. The innovative use of microbumps for electrical coupling between interconnect interfaces showcases his commitment to advancing integrated circuit technology.

Career Highlights

Hee Kong Phoon has had a successful career, having worked with prominent companies such as Altera Corporation and Intel Corporation. His experience in these leading technology firms has equipped him with the expertise to drive innovation in the semiconductor industry.

Collaborations

Throughout his career, Hee has collaborated with talented professionals, including Kar Keng Chua and Chee Hak Teh. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies in integrated circuits.

Conclusion

Hee Kong Phoon continues to be a pivotal figure in the realm of integrated circuit innovation. His dedication to enhancing

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