Colchester, VT, United States of America

Hanyi Ding

This inventor holds 113 USPTO granted patents and 6 published patent applications and 1 EPO patent, primarily in Integrated Circuit Design (CPC class H01L22-14). Top assignees: International Business Machines Corporation, Globalfoundries Inc., Globalfoundries U.S. Inc.. Active years: 2006-2026.

USPTO Granted Patents = 113 (Patent Applications = 6)

% Patents Active = 63.7

EPO Patents = 1 (Patent Applications = 2)

Average Co-Inventor Count = 3.3

ph-index = 10

Forward Citations = 599(Granted Patents)

Forward Citations (Not Self Cited) = 557(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Essex Jct, VT (US) (2010)
Essex Jct., VT (US) (2011)
Essex Junction, VT (US) (2006 - 2015)
Colchester, NY (US) (2018)
Colchester, VT (US) (2011 - 2022)

Company Filing History:

86 out of 166,159

International Business Machines Corporation

Globalfoundries U.S. Inc.

patents

4. 1 out of 59

Globalfoundries U.S. 2 LLC

Years Active: 2006-2026

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Areas of Expertise:

Optical Receiver

Integrated Circuit

Silicon-On-Insulator

RF Testing

Millimeter Wave

Phase Shifters

Bipolar Junction Transistor

Wafer Level Packaging

Through-Silicon Via

Capacitive Switch

Probe Testing

Bandstop Filter

113 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12736747 - Photonic chips including a structure enabling measurement of the group velocity of light in a photonic component (2026-09-15),

2. 12222257 - Optical receiver photodiode testing using test optical terminal at different location than operational optical terminal (2025-02-11),

3. 11536900 - Integrated circuit structure with optical absorber layer over optical grating coupler (2022-12-27),

4. 11532864 - Microstrip line structures having multiple wiring layers and including plural wiring structures extending from one wiring layer to a shield on a different wiring layer (2022-12-20),

5. 11355409 - Chip package with emitter finger cells spaced by different spacings from a heat sink to provide reduced temperature variation (2022-06-07),

6. 11204463 - Integrated circuit structure with optical absorber layer over optical grating coupler (2021-12-21),

7. 11002763 - Probe for pic die with related test assembly and method (2021-05-11),

8. 10914897 - Optical on-wafer probing with v-groove couplers (2021-02-09),

9. 10446644 - Device structures for a silicon-on-insulator substrate with a high-resistance handle wafer (2019-10-15),

10. 10379191 - Apparatus and method for vector s-parameter measurements (2019-08-13),

11. 10256204 - Separation of integrated circuit structure from adjacent chip (2019-04-09),

12. 9910124 - Apparatus and method for vector s-parameter measurements (2018-03-06),

13. 9865514 - Inline measurement of through-silicon via depth (2018-01-09),

14. 9813264 - Millimeter wave phase shifters using tunable transmission lines (2017-11-07),

15. 9800434 - Millimeter wave phase shifters using tunable transmission lines (2017-10-24),

Title: Inventor Hanyi Ding: Pioneering Innovations in Colchester

Introduction: Hanyi Ding is a visionary inventor based in Colchester, VT, known for his groundbreaking contributions to various technological fields.

Latest Patents: Hanyi Ding holds several patents in the areas of renewable energy, artificial intelligence, and sustainable agriculture, showcasing his diverse range of expertise.

Career Highlights: With a career spanning over two decades, Hanyi Ding has worked with leading research institutions and universities to develop cutting-edge solutions that have had a significant impact on society.

Collaborations: Throughout his career, Hanyi Ding has collaborated with top companies, innovative startups, and renowned inventors to bring his ideas to life and push the boundaries of technological advancement.

Conclusion: Hanyi Ding's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors and shape the future of technology.