The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 20, 2022
Filed:
Mar. 24, 2021
Applicant:
Globalfoundries U.s. Inc., Santa Clara, CA (US);
Inventor:
Hanyi Ding, Colchester, VT (US);
Assignee:
GlobalFoundries U.S. Inc., Santa Clara, CA (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01P 3/08 (2006.01); H01P 11/00 (2006.01);
U.S. Cl.
CPC ...
H01P 3/088 (2013.01); H01P 3/081 (2013.01); H01P 3/082 (2013.01); H01P 11/003 (2013.01);
Abstract
Structures for a microstrip transmission line and methods of forming a microstrip transmission line. The microstrip transmission line includes a signal line, a shield, and multiple wiring structures connected to the signal line. Each wiring structure extends from a portion of the signal line toward the shield, and each wiring structure includes a metal feature that is positioned adjacent to the shield.
Ding, Hanyi. (2022). Microstrip line structures having multiple wiring layers and including plural wiring structures extending from one wiring layer to a shield on a different wiring layer (U.S. Patent No. 11532864). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11532864
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile