The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 11, 2021

Filed:

Aug. 10, 2018
Applicant:

Globalfoundries U.s. Inc., Santa Clara, CA (US);

Inventors:

Ye Wang, Essex Junction, VT (US);

Hanyi Ding, Colchester, VT (US);

Timothy M. Platt, Williston, VT (US);

Assignee:

GLOBALFOUNDRIES U.S. Inc., Santa Clara, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01R 1/073 (2006.01); G01R 1/067 (2006.01);
U.S. Cl.
CPC ...
G01R 1/0735 (2013.01); G01R 1/06772 (2013.01);
Abstract

Embodiments of the disclosure provide a probe structured for electrical and photonics testing of a photonic integrated circuit (PIC) die, the probe including: a membrane having a first surface and an opposing second surface and including conductive traces, the membrane being configured for electrical coupling to a probe interface board (PIB); a set of probe tips positioned on the membrane, the set of probe tips being configured to send electrical test signals to the PIC die or receive electrical test signals from the PIC die; and a photonic test assembly disposed on the membrane and electrically coupled to the conductive traces of the membrane, the photonic test assembly positioned for substantial alignment with a photonic I/O element of the PIC die, wherein the photonic test assembly is configured to transmit a photonic input signal to the photonic I/O element or detect a photonic output signal from the photonic I/O element.


Find Patent Forward Citations

Loading…