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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11355409 B1

PDFFull Text
Date of Patent:
Jun. 07, 2022

Filed:

May. 07, 2019

Chip package with emitter finger cells spaced by different spacings from a heat sink to provide reduced temperature variation

Applicant:

Globalfoundries U.s. Inc., Santa Clara, CA (US);

Inventors:

Hanyi Ding, Colchester, VT (US);

Vibhor Jain, Essex Junction, VT (US);

Alvin J. Joseph, Williston, VT (US);

Anthony K. Stamper, Williston, VT (US);

Assignee:

GlobalFoundries U.S. Inc., Santa Clara, CA (US);

Attorneys:

Thompson Hine LLP

Anthony Canale

Primary Examiner:

Anh D Mai

Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 23/367 (2006.01); H01L 29/08 (2006.01); H01L 21/48 (2006.01); H01L 29/417 (2006.01); H01L 29/732 (2006.01);
U.S. Cl.
CPC ...
H01L 23/367 (2013.01); H01L 21/4882 (2013.01); H01L 29/0804 (2013.01); H01L 29/41708 (2013.01); H01L 29/66272 (2013.01); H01L 29/732 (2013.01);
Abstract

Chip packages and methods of forming a chip package. The chip package includes a power amplifier and a thermal pathway structure configured to influence transport of heat energy. The power amplifier includes a first emitter finger and a second emitter finger having at least one parameter that is selected based upon proximity to the thermal pathway structure.

Find Patent Forward Citations

Ding, Hanyi. (2022). Chip package with emitter finger cells spaced by different spacings from a heat sink to provide reduced temperature variation (U.S. Patent No. 11355409). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11355409

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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