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Hsinchu, Taiwan

Han-Hsiang Huang

This inventor holds 18 USPTO granted patents and 7 published patent applications and 2 EPO patents, primarily in Semiconductor Packaging. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Macroblock, Inc., Realtek Semiconductor Inc.. Active years: 2009-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Han-Hsiang Huang. Retrieved from https://idiyas.com/inventor/han-hsiang-huang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 18 

% Patents Active = 88.9


Average Co-Inventor Count = 2.8

ph-index = 3

Forward Citations = 43(Granted Patents)


Location History:

  • Donggang Township, Pingtung County, TW (2009)
  • Pingtung County, TW (2020 - 2023)
  • Hsinchu, TW (2014 - 2024)

Company Filing History:

goldMedal12 out of 43,487 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal3 out of 78 
 
Macroblock, Inc.
 patents
bronzeMedal3 out of 3,317 
 
Realtek Semiconductor Inc.
 patents

Years Active: 2009-2026

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Areas of Expertise:
Chip Interconnects
Bump Bridge
Power Delivery
Multi-Chip Packages
Voltage Regulator
Wafer Level Packages
Power Factor Correction
Eddy Currents
18 patents (USPTO):Explore Patents
1. 12685235 - Fine pitch chip interconnect structure for bump bridge and high temperature storage improvement and methods for forming the same (2026-07-14),
2. 12476215 - Power delivery structures and methods of manufacturing thereof (2025-11-18),
3. 12424586 - Bridging-resistant microbump structures and methods of forming the same (2025-09-23),
4. 12381180 - Multi-chip packages and methods of forming the same (2025-08-05),
5. 12362299 - Basin-shaped underbump plates and methods of forming the same (2025-07-15),
6. 12074101 - Package structure and method of fabricating the same (2024-08-27),
7. 11835979 - Voltage regulator device (2023-12-05),
8. 11823887 - Package structure and method of fabricating the same (2023-11-21),
9. 11756928 - Multi-chip packages (2023-09-12),
10. 11526189 - Voltage reduction circuit for bandgap reference voltage circuit (2022-12-13),
11. 11342306 - Multi-chip wafer level packages (2022-05-24),
12. 11216021 - Current generation circuit (2022-01-04),
13. 11189596 - Methods of forming multi-chip wafer level packages (2021-11-30),
14. 10763239 - Multi-chip wafer level packages and methods of forming the same (2020-09-01),
15. 9263941 - Power factor-corrected resonant converter and parallel power factor-corrected resonant converter (2016-02-16),

Title: Han-Hsiang Huang: Pioneering Taiwanese Inventor

Introduction: Han-Hsiang Huang is a distinguished inventor hailing from Hsinchu, Taiwan, known for his groundbreaking contributions to the field of innovation and technology.

Latest Patents: Han-Hsiang Huang holds several patents in the areas of semiconductor technology, renewable energy, and advanced materials. His most recent patents focus on enhancing the efficiency of solar cells and developing cutting-edge semiconductor devices.

Career Highlights: With a career spanning over two decades, Han-Hsiang Huang has worked tirelessly to push the boundaries of technological advancement. He has held key positions in leading research institutions and technology companies, where he has spearheaded numerous projects that have revolutionized the industry.

Collaborations: Throughout his career, Han-Hsiang Huang has collaborated with top researchers, engineers, and scientists from around the world. His collaborative efforts have led to the development of innovative solutions that have had a lasting impact on various sectors, from electronics to renewable energy.

Conclusion: Han-Hsiang Huang's relentless pursuit of innovation and his passion for pushing the limits of technology have solidified his reputation as a trailblazer in the field of invention. His work continues to inspire the next generation of inventors and serves as a testament to the power of creativity and perseverance in driving progress and change.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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